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FMM Delegates Explore the Future of Packaging at WEPACK ASEAN 2024

Dato' Andrew Goh Boon Kim, FMM Vice President, delivered a Welcome Address at WEPACK ASEAN 2024, a premier exhibition for the Southeast Asian packaging and printing industry, brought together industry leaders and innovators at MITEC KL on November 14-16, 2024. The event showcased a wide range of innovative packaging solutions, including sustainable packaging materials, smart packaging technologies, and advanced printing techniques. FMM played an active role in the event, coordinating a delegation of 59 delegates from 32 member companies to explore the latest packaging technologies and solutions on display.





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